/* AIC featured guide covers — 2026-10-06 */
body .aic-editorial a.aic-news-cover[href*="aic_article="] {
  display: block !important;
  width: 100%;
  height: auto !important;
  aspect-ratio: 40 / 21;
  padding: 0 !important;
  background-color: #071525 !important;
  background-image: url("AIC_04_MARKET.webp") !important;
  background-position: center center !important;
  background-repeat: no-repeat !important;
  background-size: contain !important;
  overflow: hidden;
}
body .aic-editorial a.aic-news-cover[href*="aic_article="] > svg {
  display: none !important;
}

body .aic-editorial a.aic-news-cover[href*="aic_article=micron-memory-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=ddr5-procurement"],
body .aic-editorial a.aic-news-cover[href*="aic_article=nand-market-procurement"] {
  background-image: url("AIC_01_PRICE.webp") !important;
}

body .aic-editorial a.aic-news-cover[href*="aic_article=nxp-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=renesas-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=xilinx-fpga-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=igbt-procurement"],
body .aic-editorial a.aic-news-cover[href*="aic_article=eol-strategy"] {
  background-image: url("AIC_02_EOL.webp") !important;
}

body .aic-editorial a.aic-news-cover[href*="aic_article=analog-devices-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=texas-instruments-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=infineon-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=stmicroelectronics-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=microchip-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=onsemi-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=intel-fpga-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=samsung-memory-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=sk-hynix-sourcing"],
body .aic-editorial a.aic-news-cover[href*="aic_article=mlcc-procurement"],
body .aic-editorial a.aic-news-cover[href*="aic_article=mosfet-procurement"],
body .aic-editorial a.aic-news-cover[href*="aic_article=fpga-market-procurement"],
body .aic-editorial a.aic-news-cover[href*="aic_article=mcu-procurement"],
body .aic-editorial a.aic-news-cover[href*="aic_article=automotive-semiconductor"],
body .aic-editorial a.aic-news-cover[href*="aic_article=long-lead-time-strategy"],
body .aic-editorial a.aic-news-cover[href*="aic_article=emergency-sourcing-guide"] {
  background-image: url("AIC_03_SUPPLY.webp") !important;
}

body .aic-editorial a.aic-news-cover[href*="aic_article=hbm-market-procurement"],
body .aic-editorial a.aic-news-cover[href*="aic_article=sic-procurement"],
body .aic-editorial a.aic-news-cover[href*="aic_article=gan-procurement"],
body .aic-editorial a.aic-news-cover[href*="aic_article=ai-server-components"],
body .aic-editorial a.aic-news-cover[href*="aic_article=datacenter-components"],
body .aic-editorial a.aic-news-cover[href*="aic_article=counterfeit-components"] {
  background-image: url("AIC_04_MARKET.webp") !important;
}